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発表年月
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タイトル／共同研究者
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掲載誌
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巻・号・頁
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学術機関等
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| 2022/06 |
Class I Creep Deformation of Sn？Ag？Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder
Joints
Masaki Moriuchi, Yoshiharu Kariya, Mao Kondo, Yoshihiko Kanda
|
MATERIALS TRANSACTIONS |
63巻
6号
805から
812ページまで
|
Japan Institute of Metals |
| 2022/05 |
Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of
Insulating Polymer
Koichi Nagase, Atsushi Fujii, Kaiwen Zhong, Yoshiharu Kariya
|
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
1602から
1607ページまで
|
IEEE |
| 2022/01 |
Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling
Hiroki Kanai, Yoshiharu Kariya, Hiroshige Sugimoto, Yoshiki Abe, Yoshinori Yokoyama, Koki Ochi, Ryuichiro Hanada, Shinnosuke
Soda
|
MATERIALS TRANSACTIONS |
|
Japan Institute of Metals |
| 2021/10 |
Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA
Moe Nozaki, Yoshiharu Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, Kenichi Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack
Tan
|
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
|
IEEE |
| 2021/10 |
Reproduction Analysis of Fatigue Crack Networks in Sn-Ag-Cu Die Attach Joint by FEA
Hiroki Kanai, Yoshiharu Kariya, Yoshiki Abe, Yoshinori Yokoyama, Koki Ochi, Ryuichiro Hanada, Shinichi Izuo
|
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
|
IEEE |
| 2021/02 |
Thermal Fatigue Life Prediction of BGA Solder Joints Using a Creep Constitutive Equation Incorporating Microstructural Coarsening
Effect
Kouichi Morooka, Yoshiharu Kariya
|
MATERIALS TRANSACTIONS |
62巻
2号
205から
212ページまで
|
Japan Institute of Metals |
| 2021/01 |
Finite Element Analysis of Delamination of Redistribution Layer in Semiconductor Package Structure
Kenta ONO, Yoshiharu KARIYA
|
Journal of Smart Processing |
10巻
5号
286から
293ページまで
|
Sumart Processing Society for Minerals, Environment and Energy |
| 2020/10 |
Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of
Test Parameters on the Joint Fatigue Life
Kosuke Hosoya, Yoshiharu Kariya, Hiroshige Sugimoto, Kuniaki Takahashi
|
Journal of Electronic Materials |
49巻
10号
6175から
6186ページまで
|
Springer Science and Business Media LLC |
| 2020/07 |
Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
Yuji Okada, Atsushi Fujii, Kenta Ono, Yoshiharu Kariya
|
Journal of Photopolymer Science and Technology |
33巻
2号
171から
176ページまで
|
Technical Association of Photopolymers, Japan |
| 2020/01 |
Novel Fatigue Crack Propagation Analysis of Solder Joint Using Singularity of Strain Energy Density in the Crack Tip Near
Field
Yuta Nakajima, Yoshiharu Kariya, Keisuke Ono
|
MATERIALS TRANSACTIONS |
|
Japan Institute of Metals |
| 2020/01 |
Formation Mechanisms of Thermal Fatigue Crack Networks in Sn-Ag-Cu Die-attach Joint in High Speed Thermal Cycling
Hiroshige SUGIMOTO, Yoshiharu KARIYA, Yoshiki ABE, Ryuichiro HANADA, Yoshinori YOKOYAMA, Shinnosuke SODA
|
Journal of Smart Processing |
9巻
5号
224から
231ページまで
|
Sumart Processing Society for Minerals, Environment and Energy |
| 2019/05 |
Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package
Kenta Ono, Yoshiharu Kariya
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
46から
|
|
| 2019/05 |
Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening
Kouichi Moroka, Yoshiharu Kariya
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
48から
|
|
| 2019/05 |
Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device
Kiichi Nagata, Yoshiharu Kariya, Shoji Horie
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
80から
|
|
| 2019/05 |
High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles
Koji Osaki, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
81から
|
|
| 2019/05 |
Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method
Yuga Sato, Yoshiharu Kariya
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
47から
|
|
| 2019/05 |
Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device
Hiroshige Sugimoto, Yoshiharu Kariya, Ryuichiro Hanada, Akihisa Fukumoto, Yusaku Ito, Shinnosuke Soda
|
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 |
82から
|
|
| 2019/01 |
単結晶ビスマスにおける双晶回復挙動
坂居 貴雅, 苅谷 義治, 渡邉 裕彦, 外薗 洋昭
|
スマートプロセス学会誌 |
8巻
5号
198から
204ページまで
|
一般社団法人 スマートプロセス学会 （旧高温学会） |
| 2019/01 |
Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density
Yuta Nakajima, Keisuke Ono, Yoshiharu Kariya
|
Materials Transactions |
60巻
876から
881ページまで
|
|
| 2019/01 |
Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains
Takumi Sasaki, Atsushi Yanase, Dai Okumura, Yoshiharu Kariya, Masaaki Koganemaru, Toru Ikeda
|
Materials Transactions |
60巻
6号
868から
875ページまで
|
JAPAN INST METALS & MATERIALS |
| 2019/01 |
Special issue on frontier researches related to interconnection, packaging and microjoining materials and microprocessing
for such materials -part II-preface
Ikuo Shohji, Yoshiharu Kariya
|
Materials Transactions |
60巻
849から
|
|
| 2019/01 |
Influence of silica filler addition on fatigue crack propagation rate of underfill resin
Jun Ishibashi, Yoshiharu Kariya, Toshiyuki Satoh, Toshiaki Enomoto, Hiroshi Yamaguchi
|
Materials Transactions |
60巻
902から
908ページまで
|
|
| 2019/01 |
Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue
life prediction of sintered joint
Takahiko Sato, Yoshiharu Kariya, Hiroki Takahashi, Taishi Nakamura, Yuki Aiko
|
Materials Transactions |
60巻
850から
857ページまで
|
|
| 2018/03 |
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via
Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi
Shimizu
|
Microelectronics Reliability |
82巻
20から
27ページまで
|
Elsevier Ltd |
| 2018/01 |
Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles
Ryo Kimura, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki
|
Materials Transactions |
59巻
4号
612から
619ページまで
|
Japan Institute of Metals (JIM) |
| 2018/01 |
Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals
Yuichi Yanaka, Yoshiharu Kariya, Hirohiko Watanabe, Hiroaki Hokazono
|
Journal of Electronic Materials |
47巻
1号
594から
603ページまで
|
Springer New York LLC |
| 2017/02 |
Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles
Ryutaro Shioda, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki
|
JOURNAL OF ELECTRONIC MATERIALS |
46巻
2号
1155から
1162ページまで
|
SPRINGER |
| 2017/01 |
Study on Low-cycle Fatigue Testing and Thermal Fatigue Life Prediction of Electroplated Copper Thin Film for Through Hole
Via
Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu
|
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) |
85から
85ページまで
|
IEEE |
| 2017/01 |
Temperature Dependence of Fatigue Crack Propagation Rate of Pressureless Sintered Ag Nanoparticles
Ryo Kimura, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki
|
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) |
86から
86ページまで
|
IEEE |
| 2016/06 |
Effect of Sintering Temperature on Stress Relaxation Behavior of Sintered Nano-sized Ag Particles
SHIODA Ryutaro, KARIYA Yoshiharu, MIZUMURA Noritsuka, SASAKI Koji
|
スマートプロセス学会誌 |
5巻
4号
259から
265ページまで
|
高温学会 |
| 2016/01 |
Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes
Yuichi Yanaka, Yoshiharu Kariya, Hirohiko Watanabe, Hiroaki Hokazono
|
MATERIALS TRANSACTIONS |
57巻
6号
819から
823ページまで
|
JAPAN INST METALS |
| 2016/01 |
Thermal Fatigue Life Evaluation of Epoxy Resin/Si Joint under Mineral Oil Condition
Hideto Takahashi, Yoshiharu Kariya
|
MATERIALS TRANSACTIONS |
57巻
6号
805から
809ページまで
|
JAPAN INST METALS |
| 2016/01 |
Higher Thermal Cycling Reliability of Power Semiconductor Module for Power Converters
Akira Morozumi, H. Hokazono, Yoshitaka Nishimura, Yoshiharu Kariya, Eiji Mochizuki, Yoshikazu Takahashi
|
2016 International Conference on Electronics Packaging (ICEP) |
405から
410ページまで
|
IEEE |
| 2016/01 |
Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy
Maiko Taniguchi, Yoshiharu Kariya
|
MATERIALS TRANSACTIONS |
57巻
6号
853から
859ページまで
|
JAPAN INST METALS |
| 2016/01 |
Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing
for Such Materials PREFACE
Yoshiharu Kariya, Ikuo Shohji
|
MATERIALS TRANSACTIONS |
57巻
6号
796から
796ページまで
|
JAPAN INST METALS |
| 2014/01 |
EFFECT OF TEMPERATURE AND STRAIN RATE ON LOW-CYCLE FATIGUE LIFE OF BI-SN EUTECTIC ALLOY
Takuma Sato, Yoshiharu Kariya, Kazuma Fukui
|
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC
MICROSYSTEMS, 2013, VOL 1
|
|
AMER SOC MECHANICAL ENGINEERS |
| 2014/01 |
Microstructural Analysis of Low-cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
|
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC
MICROSYSTEMS, 2013, VOL 1
|
|
AMER SOC MECHANICAL ENGINEERS |
| 2013/07 |
Mechanical Behavior of Sintered Nano-sized Ag Particles
KARIYA Yoshiharu, YAMAGUCHI Hideaki, ITAKO Masahiro, MIZUMURA Noritsuka, SASAKI Koji
|
スマートプロセス学会誌 |
2巻
4号
164から
169ページまで
|
Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan) |
| 2013/07 |
Bi-Sn共晶合金の低サイクル疲労寿命におよぼす温度とひずみ速度の影響
佐藤 琢磨, 苅谷 義治, 福井 一真, 松岡 洋, 矢野 雅史
|
エレクトロニクス実装学会誌 = Journal of Japan Institute of Electronics Packaging |
16巻
4号
293から
299ページまで
|
一般社団法人エレクトロニクス実装学会 |
| 2013/01 |
A Finite Element Analysis of Board Level Drop Reliability Test and Analysis of Stress Buffer Effect of Polyimide
Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya
|
2013 IEEE 3RD CPMT SYMPOSIUM JAPAN (ICSJ 2013) |
|
IEEE |
| 2013/01 |
Analysis of Stress Buffer Effect of Polyimide for Board Level Drop Test by a Finite Element Analysis
Nobuhiro Anzai, Mitsuru Fujita, Kazutoshi Sakamaki, Yoshiharu Kariya
|
2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) |
120から
123ページまで
|
IEEE |
| 2012/11 |
Ag-エポキシ系導電性接着剤の粘弾性挙動と低サイクル疲労寿命解析
苅谷 義治, 古澤 弘充, 神田 喜彦
|
電子情報通信学会論文誌. C, エレクトロニクス = The transactions of the Institute of Electronics, Information and Communication Engineers. C |
95巻
11号
358から
364ページまで
|
一般社団法人電子情報通信学会 |
| 2012/07 |
Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test
Yoshihiko Kanda, Yoshiharu Kariya
|
MICROELECTRONICS RELIABILITY |
52巻
7号
1435から
1440ページまで
|
PERGAMON-ELSEVIER SCIENCE LTD |
| 2012/03 |
Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint
Yoshihiko Kanda, Yoshiharu Kariya, Yuji Oto
|
JOURNAL OF ELECTRONIC MATERIALS |
41巻
3号
580から
587ページまで
|
SPRINGER |
| 2012/01 |
Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints
Yoshihiko Kanda, Yoshiharu Kariya, Takeshi Tasaka
|
MATERIALS TRANSACTIONS |
53巻
12号
2072から
2077ページまで
|
JAPAN INST METALS |
| 2012/01 |
Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-Joint
Yoshiharu Kariya, Sho Tajima, Saori Yamada
|
MATERIALS TRANSACTIONS |
53巻
12号
2067から
2071ページまで
|
JAPAN INST METALS |
| 2012/01 |
Effect of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for Sn Based Alloy
Yoshihiko Kanda, Yuji Oto, Yusuke Shiigi, Yoshiharu Kariya
|
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC
SYSTEMS, MEMS AND NEMS 2011, VOL 2
|
713から
|
AMER SOC MECHANICAL ENGINEERS |
| 2012/01 |
Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint
Tashiro Naoki, Yoshiharu Kariya, Yoshihiko Kanda
|
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC
SYSTEMS, MEMS AND NEMS 2011, VOL 2
|
707から
|
AMER SOC MECHANICAL ENGINEERS |
| 2010/10 |
Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint
Yoshiharu Kariya, Yoshihiko Kanda, Keitaro Iguchi, Hiromitsu Furusawa
|
MATERIALS TRANSACTIONS |
51巻
10号
1779から
1784ページまで
|
JAPAN INST METALS |
| 2010/02 |
Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint
Yoshihiko Kanda, Yoshiharu Kariya
|
JOURNAL OF ELECTRONIC MATERIALS |
39巻
2号
238から
245ページまで
|
SPRINGER |
| 2010/01 |
VISCO-ELASTIC EFFECT OF UNDERFILL MATERIAL IN RELIABILITY ANALYSIS OF FLIP-CHIP PACKAGE
Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi
Hirata
|
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 |
755から
759ページまで
|
AMER SOC MECHANICAL ENGINEERS |
| 2010/01 |
Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing
Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Hironori Oota, Shunichi Kikuchi, Hideki Yamabe, Kazuhiko Nakamura
|
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS |
|
IEEE |
| 2010/01 |
Effect of Joint Size on Low-cycle Fatigue Properties of Sn-Ag-Cu Solder Joint
Yoshiharu Kariya, Kana Sat, Shota Asari, Yoshihiko Kanda
|
2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS |
|
IEEE |
| 2009/01 |
エレクトロニクス分野の導電性接着剤技術の動向
菅沼 克昭, 進藤 大輔, 大塚 寛治, 苅谷 義治
|
エレクトロニクス実装学会誌 = Journal of Japan Institute of Electronics Packaging |
12巻
1号
79から
85ページまで
|
社団法人エレクトロニクス実装学会 |
| 2009/01 |
微小体積におけるSn‐Ag‐Cu合金の凝固組織と力学特性
秋山充洋, 苅谷義治, 伊藤勉
|
Symp Microjoining Assem Technol Electron |
15th巻
349から
352ページまで
|
|
| 2008/07 |
Effect of hold time on low cycle fatigue life of micro solder joint
Yoshhiko Kanda, Yoshiharu Kariya, Yusuke Mochizuki
|
MATERIALS TRANSACTIONS |
49巻
7号
1524から
1530ページまで
|
JAPAN INST METALS |
| 2008/05 |
Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders
Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda, Tadashi Takemoto
|
MATERIALS TRANSACTIONS |
49巻
5号
1175から
1179ページまで
|
JAPAN INST METALS |
| 2008/01 |
鉛フリーはんだ関係 微小体積における鉛フリーはんだの力学的特徴
苅谷 義治
|
エレクトロニクス実装学会誌 |
11巻
5号
368から
374ページまで
|
一般社団法人エレクトロニクス実装学会 |
| 2007/05 |
Low-cycle fatigue properties of eutectic solders at high temperatures
Yoshiharu Kariya, Tadatomo Suga
|
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES |
30巻
5号
413から
419ページまで
|
BLACKWELL PUBLISHING |
| 2007/02 |
機械的特性
苅谷 義治
|
溶接学会誌 = Journal of the Japan Welding Society |
76巻
2号
109から
113ページまで
|
社団法人溶接学会 |
| 2007/01 |
Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints
Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumil
|
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS |
684から
|
IEEE |
| 2005/11 |
Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen
Y Kariya, T Niimi, T Suga, M Otsuka
|
MATERIALS TRANSACTIONS |
46巻
11号
2309から
2315ページまで
|
JAPAN INST METALS |
| 2005/03 |
はんだ材料の非線形特性と熱疲労信頼性
苅谷 義治, 向井 稔
|
エレクトロニクス実装学会誌 = Journal of Japan Institute of Electronics Packaging |
8巻
2号
150から
155ページまで
|
社団法人エレクトロニクス実装学会 |
| 2005/01 |
Mechanical properties of lead-free solder alloys evaluated by miniature size specimen
Yoshiharu Kariya, Tsuyoshi Asai, Tadatomo Suga
|
Proceedings of SPIE - The International Society for Optical Engineering |
5852 PART I巻
297から
301ページまで
|
|
| 2005/01 |
Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen.
Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka
|
Advances in Electronic Packaging 2005, Pts A-C |
1827から
1832ページまで
|
AMER SOC MECHANICAL ENGINEERS |
| 2004/08 |
Structural integrity in electronics
WJ Plumbridge, Y Kariya
|
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES |
27巻
8号
723から
734ページまで
|
BLACKWELL PUBLISHING LTD |
| 2004/06 |
鉛フリーはんだ合金におけるスズペスト
苅谷 義治
|
熱処理 = Journal of The Japan Society for Heat Treatment |
44巻
3号
133から
134ページまで
|
|
| 2004/01 |
Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka
|
Journal of Electronic Materials |
33巻
4号
321から
328ページまで
|
Minerals, Metals and Materials Society |
| 2004/01 |
Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition
Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka, Tadatomo Suga
|
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
2巻
103から
108ページまで
|
|
| 2004/01 |
Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition
Shinichi Terashima, Yoshiharu Kariya, Masamoto Tanaka
|
Materials Transactions |
45巻
3号
673から
680ページまで
|
Japan Institute of Metals (JIM) |
| 2004/01 |
Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects
Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka
|
Materials Transactions |
45巻
3号
689から
694ページまで
|
Japan Institute of Metals (JIM) |
| 2003/01 |
Isothermal shear fatigue life of Sn-xAg-0.5Cu flip chip interconnects
Y Kariya, T Hosoi
|
ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1 |
1巻
155から
160ページまで
|
AMER SOC MECHANICAL ENGINEERS |
| 2003/01 |
Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects
Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka
|
Journal of Electronic Materials |
32巻
12号
1527から
1533ページまで
|
Minerals, Metals and Materials Society |
| 2003/01 |
The Constitutive Creep Equation for a Eutectic Sn-Ag Alloy Using the Modified Theta-Projection Concept
Yoshiharu Kariya, Masahisa Otsuka, William J. Plumbridge
|
Journal of Electronic Materials |
32巻
12号
1398から
1402ページまで
|
Minerals, Metals and Materials Society |
| 2001/01 |
Tin pest in lead-free solders
Y Kariya, C Gagg, WJ Plumbridge
|
SOLDERING & SURFACE MOUNT TECHNOLOGY |
13巻
1号
39から
40ページまで
|
MCB UNIV PRESS LTD |
| 2001/01 |
Tin pest in Sn-0.5 wt.% Cu lead-free solder
Y. Kariya, N. Williams, C. Gagg, W. Plumbridge
|
JOM |
53巻
39から
41ページまで
|
|
| 2001/01 |
Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach
Yoshiharu Kariya, Tomoo Morihata, Eisaku Hazawa, Masahisa Otsuka
|
Journal of Electronic Materials |
30巻
1184から
1189ページまで
|
|
| 2000/08 |
Infrared Emission Spectra of CaF_2-CaO-SiO_2 Melt
UEDA Shigeru, KOYO Hirotaka, IKEDA Takashi, KARIYA Yoshiharu, MAEDA Masafumi
|
ISIJ international |
40巻
8号
739から
743ページまで
|
The Iron and Steel Institute of Japan |
| 2000/03 |
鉛フリーはんだ付施工技術および信頼性
苅谷 義治, 大塚 正久
|
溶接学会誌 = Journal of the Japan Welding Society |
69巻
2号
108から
112ページまで
|
社団法人溶接学会 |
| 1999/12 |
Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint
Yoshiharu Kariya, Yasunori Hirata, Kenji Warashina, Masahisa Otsuka
|
American Society of Mechanical Engineers, EEP |
26 3巻
173から
180ページまで
|
|
| 1999/01 |
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints
Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka
|
Journal of Electronic Materials |
28巻
11号
1263から
1269ページまで
|
Minerals, Metals & Materials Soc (TMS) |
| 1999/01 |
Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X = Bi and Cu) solder joints
K Warashina, Y Kariya, Y Hirata, M Otsuka
|
FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS |
626から
631ページまで
|
IEEE COMPUTER SOC |
| 1998/06 |
マイクロ接合用はんだの無鉛化に関する最近の研究動向
大塚 正久, 苅谷 義治
|
熱処理 |
38巻
3号
135から
140ページまで
|
日本熱処理技術協会 |
| 1998/01 |
Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
Yoshiharu Kariya, Masahisa Otsuka
|
Journal of Electronic Materials |
27巻
11号
1229から
1235ページまで
|
Minerals, Metals and Materials Society |
| 1998/01 |
Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
Yoshiharu Kariya, Masahisa Otsuka
|
Journal of Electronic Materials |
27巻
7号
866から
870ページまで
|
Minerals, Metals and Materials Society |
| 1993/01 |
Infrared Emission Spectra of a Thin Film of Molten Alkali-metal Nitrates.
Maeda Masafumi, Kariya Yoshiharu
|
ISIJ International |
33巻
1号
182から
187ページまで
|
The Iron and Steel Institute of Japan |